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AMD Ryzen 7 5700X3D Processor Features
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A case powerful, still stylish strong and compact, radiators friendly on top and front, ease of use with removable mounting brackets. LANCOOL 205, the standard case with tempered glass that fits with maximum of ATX motherboard.
Bigger in every way a mighy powerful chassis. Modular design flexiblity for any configuration. Hot swappable drives.spacious for multiple and bigger components.Seamlessly supporting E-ATX motherboards.RGB lighting sync front panel addressable RGB.
LANCOOL II MESH Performance features a mesh front panel and mesh bottom left shroud panel, honeycomb vent design and built-in PWM fans, ensuring bountiful airflow delivered to your components while the system runs at peak performance.
TU150 use of a tempered glass main panel means a modern internal aesthetic along with proper masking to hide internal cabling. Another neat cable management trick is that Lian Li allows the top panel where the handle recesses to hide wiring as well.
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