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AMD Ryzen 7 5700X3D Processor Features
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Small tower with big airflow, the O11 AIR MINI provides modular design for ATX, M-ATX or ITX motherboards. Being all about the air, O11 AIR MINI has a spacious interior to accommodate multiple confirgurations of fan and radiator setups to maximize the airflow.
A case powerful, still stylish strong and compact, radiators friendly on top and front, ease of use with removable mounting brackets. LANCOOL 205, the standard case with tempered glass that fits with maximum of ATX motherboard.
LANCOOL II MESH RGB features a mesh front panel and mesh bottom left shroud panel,honeycomb vent design and built-in RGB fans,ensuring bountiful airflow delivered to your high-performance components while adorning the system with an RGB touch.
TU150 use of a tempered glass main panel means a modern internal aesthetic along with proper masking to hide internal cabling. Another neat cable management trick is that Lian Li allows the top panel where the handle recesses to hide wiring as well.
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