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AMD Ryzen 7 5700X3D Processor Features
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A case powerful, still stylish strong and compact, radiators friendly on top and front, ease of use with removable mounting brackets. LANCOOL 205, the standard case with tempered glass that fits with maximum of ATX motherboard.
Bigger in every way a mighy powerful chassis. Modular design flexiblity for any configuration. Hot swappable drives.spacious for multiple and bigger components.Seamlessly supporting E-ATX motherboards.RGB lighting sync front panel addressable RGB.
TU150 use of a tempered glass main panel means a modern internal aesthetic along with proper masking to hide internal cabling. Another neat cable management trick is that Lian Li allows the top panel where the handle recesses to hide wiring as well.
The Lian Li Q58 Mini-ITX Case with PCIe 4.0 Riser Card promotes airflow while displaying the components. The dual-side split hinge panels feature two swappable 3.0mm thick tempered glass panels and two 1.0mm fine mesh panels. Compatible for both SFX and ATX PSU, the Q58 comes with an additional bracket to transform from SFX PSU mode to ATX PSU mode.
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